Confocal Scanning Acoustic Microscopy (CSAM)

Confocal Scanning Acoustic Microscopy (CSAM) is a non-destructive imaging technique used to inspect the internal structure of semiconductor devices, PCBs, and electronic packages. It uses high-frequency ultrasound to detect delamination, voids, cracks, and other hidden defects. CSAM generates high-resolution 2D or 3D acoustic images of the internal layers, making it an essential tool for failure analysis, quality control, and reliability testing of microelectronic components.

Applications

• Void & Delamination Detection:Identify hidden defects in flip-chip, BGA, CSP, and other semiconductor packages.
• Wire Bond & Interconnect Inspection:Detect poorly bonded wires, lift-off, or weak connections.
• Failure Analysis:Locate internal defects contributing to device degradation or electrical failure.
• Quality Control:Ensure package integrity and compliance with manufacturing standards.
• Reliability Assessment:Monitor the effects of thermal cycling, mechanical stress, or aging on internal structures.
• Research & Development:Support evaluation of new packaging technologies, materials, and process optimization.
• PCB & Multilayer Inspection:Examine internal layers, adhesion, and hidden structural anomalies without dismantling.