2D & 3D X-Ray Analysis

2D and 3D X-Ray Analysis is a non-destructive technique used to visualize the internal structures of semiconductor devices, PCBs, and electronic components. 2D X-ray provides flat images for quick inspection, while 3D X-ray (computed tomography) reconstructs the internal volume, allowing detailed visualization of solder joints, wire bonds, voids, and hidden defects. This method is essential for failure analysis, quality control, and reliability assessment without dismantling the device.

Applications

• Internal Defect Detection:Identify voids, cracks, delamination, and solder joint issues in semiconductor packages and PCBs.
• Wire Bond & Flip-Chip Inspection:Examine internal connections, bumps, and bond integrity.
• Package Verification:Assess multilayer structures, encapsulation, and hidden features.
• Failure Analysis:Locate defects contributing to electrical or mechanical failures.
• Reliability Assessment:Monitor defects and structural integrity over thermal or mechanical stress tests.
• Quality Control:Verify soldering quality, component placement, and internal assembly consistency.
• Research & Development:Support package design optimization, materials evaluation, and new device prototyping.