Semiconductor Failure Analysis & Reliability Testing


Semiconductor Failure Analysis and Reliability Testing involve a range of techniques to evaluate the performance, integrity, and long-term reliability of semiconductor devices. These tests help identify defects, weak points, or process issues, ensuring device quality, optimizing design, and preventing in-field failures. Techniques include electrical testing, thermal analysis, imaging, and stress testing to comprehensively assess semiconductor performance


Product Brand

  • 0 Wasson- Ece

2D & 3D X-Ray Analysis

Confocal Scanning Acoustic Microscopy (CSAM)

Electrical Verification (I-V, Parametric Test)

High Temperature Oven Test

Optical Beam Induced Resistance Change (OBIRCH)

Photoemission Microscopy

Salt Spray Test

Solderability Test

Temperature & Humidity Cycling Test

Thermal Emission Microscopy (THEM)

Thermal Shock Test