WeissTechnik Oven

WeissTechnik Oven

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Description

In the area of industrial heating technology, our experienced team develops, plans and produces reliable systems for almost every possible area of application. Our product portfolio includes a broad range of heating and drying cabinets, cleanroom dryers, hot-air sterilisers, infra-red and continuous furnaces, and innovative microwave technology too. Alongside our comprehensive selection of series products, we also focus on the implementation of customer-specific, process-integrated solutions.

Features:

  • 3 sizes: 60, 100 and 200 liter chamber volume
  • Temperature range 50°C to 300°C
  • 3 variants as stock units for short delivery times : Basic, Premium and Premium plus
  • Inner chamber made of stainless steel ANSI 316
  • JUMO diraTron PID program controller
  • CE conformity acc. to EC Machine Guide 2006/42/EG
  • Switch Box in IP 54
  • Over temperature limit cut-off class 2

Product Descriptions:

Best in class temperature deviation

  • ±1% of actual value
  • Fulfilling testing standards

Ethernet interface

  • TCP/IP protocol
  • Driver for SIMPATI for documentation, set-point and program start/stop

Dimensions

  • Inner chamber dimensions as Heraeus series 6000
  • Outer dimensions similar

vötschoven Lab series

  • Manual exhaust air flap
  • diraTron
  • Ethernet, 1 program, Timer
  • Lockable door
  • Potential free alarm contact
  • Controller alarm
  • Electrical door switch
  • Full access switch box
  • Stackable with recesses against slip on top of each unit
  • Up to 3 units
  • Ageing of plastic test specimen
  • Ageing of insulated cables and wires
  • Burn-in-Tests/long term stress test of electronic components, printed circuits and instruments
  • High-temperature storage/alternating temperature tests of electronic components and modules for testing error mechanisms such as stress migration, the Kirkendall effect
  • Drying, heat treatment and thermal testing
  • Drying of cleaned machine parts, membrane filters
  • Burning in of metal parts, varnish, contacts
  • Drying of electronic components and parts
  • Drying of coated boards (printed circuits)
  • Curing of glue connections and resin
  • Cross-linking of silicone parts (below <3%LEL)

 

Additional information

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