HITACHI NX9000 Real-Time 3D Analytical FIB-SEM

Incorporates optimized layout for true high-resolution serial sectioning to tackle the latest demands in 3D structural analysis and for TEM and 3DAP analyses
Allows the highest precision in material processing for a wide range of areas relating to advanced materials, electronic devices, biological tissues, and a multitude of other applications

The SEM column and FIB column are orthogonally arranged to optimize the column positioning for 3D structural analysis
The combination of high-brightness cold-field-emission electron source and high-sensitivity optics support analysis of a wide range of materials from biological tissues to magnetic materials
The Micro-sampling system and Triple Beam system allow high-quality sample preparation for TEM and atom-probe applications
Ion milling and observation at normal incidence in real-time for true analytical imaging
Optional Cut & See, 3D-EDS, 3D-EBSD available for a wide variety of materials

Specimen: 14 nm SoC device

Final milling: 1 kV Ar

Observation: HF-3300 Cold FE-TEM (Accelerating voltage: 300 kV)