Features:
- Greatly reduce processing time using the Big Probe Current (maximum probe current 90 nA)
- Ultra low damaged TEM sample preparation by low-kV processing (0.5kV or higher) and improved SE image resolution at low kV (less than 1kV optional)
- High resolution SIM imaging (SE image resolution 4nm at 30kV)
- High precision 5-axis motorized mechanical eucentric stage
- Ease of use and various processing modes
- SIM image 3D reconstruction analysis
- Circuit modification using multi-gas injection system (MGS II), optional
- Variety of coordinate linkage function (optional)
Application

Specimen: Laminated ceramic capacitor
Cross-sectional analysis using multiple signals