FSM 900 Series

FSM 900 Series

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Stress Hysteresis in vacuum or gas up to 900C for the study of annealing cycles. Thermal Desorption, Film Shrinkage, Reflectivity, and Resistivity options provide additional insight to causes of material changes with temperature. NEW: Optional wafer rotation offers unique 2D/3D mapping to study wafer deformation as a function of temperature.
900TC-VAC -- 300mm chamber. Manual loading.
900C2C -- 300mm fully automated Cassette to Cassette system.

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