Thinning and backgrinding of wafers requires precise control of thickness, total thickness variation (TTV) and warp. FSM offers solutions for measurement of wafers and wafers on tape.
Substrate Thickness, Warp, and TTV Measurement
- with or without Tape
- for Wafer Backgrind and Etch Thinning processes.
Non-contact Echoprobe Technology.
Thin film and surface roughness options.
413 SA -- Semi-automatic system with enclosure. Manual loading, automatic measurement up to 300mm.
413 PR --Semi-automatic system with enclosure for wafers up to 300mm with or without frame .
413MOT -- Auto-Mapping, manual loading system.
413C2C -- Fully automated Cassette to Cassette System for Wafer or Dicing tape frames