FSM 413C2C — Fully Automated Cassette To Cassette System For Wafer Or Dicing Tape Frames
Thickness and total thickness variation (TTV) mapping system. TTV and thickness of wafer substrate, thick layers, wafers on tape, bonded wafers, etc. Fully automated cassette to cassette system, SECS/GEM compliant. Warp, roughness, and thin film thickness measurement options.