FSM 413 SA — Semi-Automatic System With Enclosure. Manual Loading Automatic Measurement Up To 300mm
Thickness and total thickness variation (TTV) mapping system. TTV and Thickness of wafer substrate, thick layers, wafers on tape, bonded wafers, etc. Semi-automatic system with enclosure. Manual loading, automatic measurement. Warp, roughness, and thin film thickness measurement options. Systems up to 300mm diameter wafers with or without frame.