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S-5500

 Resolution :
 0.4nm @ 30kv
 1.6 nm @ 1kv
 Stage :
 1 type(X/Y:+/-3.5 nm)
 Sample Size :
 5 x 9.5 x 3.5 (H) mm
 Magnification :
 x60~x2,000,000
 Additional features :
 Dual Gun Baking system
 Heatable Movable Aperture
 New ExB filter
 TMP

Standard features
1. The world's highest resolution at 30kV: 0.4nm at 30kV guaranteed, 1.6nm at 1kV     guaranteed.

2. Hitachi's unique variable super ExB signal mode allows operator to optimize
    secondary and backscatter signal content of the image.

3. New BF/DF Duo-STEM detector allows simultaneous display of BF and DF
    images. Variable detection angle in DF STEM mode (option).

4. Electron optical design allows EDS analysis and imaging without changing
    specimen position.

5. FIB compatible holders for seamless imaging of targeted preparation
    sites.(option).

6. Enormous magnification range of 60X – 2,000,000X.

7. Patented SE/BSE detector mode for signal mixing.

8. Unique BF/DF Duo-STEM detector option.

9. Diverse specimen holders, compatible with FIB and STEM

   Ultra-high resolution microscopy places special demands on the equipment used    to capture new information and reveal the secrets of  the  Nano-world.  The  new
   S-5500 meets these with proven technology, combining high resolution and easy    reliable operation.

   An astonishing resolution of 1.6nm at 1kV and 0.4nm at 30kV are guaranteed    onsite. The S-5500 is equipped with a shielding system for reduced EMI and    acoustic interferences. These improvements in conjunction with a completely dry    vacuum system assure our high-resolution guarantee for the life of the    instrument.

   The S-5500 boasts a host of other features such as the Dual Gun Baking System,    Heatable movable aperture, New EXB filter and TMP evacuation system, all    designed to make high resolution microscopy and analysis that much    easier.Sometimes a single image can change the way we look  at  life.  The  new
   S-5500 with its advancements in information collection will lead you to those    opportunities.

 

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