The HITACHI NB5000 FIB-SEM integrates a superior FIB column with an ultra-high-resolution Schottky FE-SEM. Like all our products, all components have been designed with considering the total system performance. This results in exceptional stability, milling performance and resolution, allowing e.g. automated mill-and-monitor operations for 3D reconstructions with slicing steps down to 2nm.

 

 

NB5000 incorporates two sample stages - one conventional eucentric stage, and an optional TEM hyper stage for ultimate stability and sample holder compatibility with STEM/TEM systems. A Hitachi proprietary micro-manipulator extracts microsamples for TEM lamella or atom probe pillar preparation.

The vertically mounted FIB allows most milling applications to be done at 0 degree stage tilt with a usable high ion current (>60nA in a sub-um spot) and ion energies up to 40kV for ultra-fast sample preparation. TEM samples can be reliably extracted via Hitachi's easy-to-use in-situ (patented) lift-out technology. Cross sections are finalized under low-kV, low-current conditions (1kV) to achieve even sub-50nm thick damage-less samples for Cs-corrected microscopy.
 

The SEM column of the NB5000 offers - like the SU-70 - a dual optics mode, with magnetic-field-free live imaging during FIB milling and final TEM lamella fabrication, and a semi-inlens immersion mode for ultra-high resolution observations. Inlens SE and BSE detection are complemented by a chamber Everhardt-Thornley detector (also available for SIM imaging) and a segmented photo-diode TE detector, offering BF and selectable angle DF imaging (also available for live sample monitoring during TEM lamella end-preparation). EDS and EBSD analytical capabilities complete the high performance SEM part.