We are able to offer an unsurpassed portfolio of chemical, laser, mechanical and plasma systems for the decapsulation of packaged devices.

Chip access, decapsulator, decapsulation, acid decapsulation, topside, jet-etching, dual-acid, laser ablation, pre-cavitation, counterfeit parts, plasma decapsulation, counterfeit solutions, nitric acid, sulfuric, product teardown, gasket milling, fillerblast.