About BEST EQ
Plasma technology utilized in manufacturing has a history dating back more than forty years. The technology utilizes dry gas chemistries and is capable of performing virtually any task that more common wet chemistries perform. The applications for gas plasma technology continue to grow at an exponential rate. There are several reasons for this…
• Worldwide reduction of CFC’s and other chemicals typically used for
cleaning and etching in wet processes. ( I.E. GLOBAL WARMING !!! )
• Wide use of composite materials in manufacturing resulting in new
challenges with bonding and adhesion.
• After initial investment plasma processes are more efficient and cost
effective.
• Plasma provides a safer and cleaner surrounding for operators and is
environmentally friendly.
• The physical and chemical characteristics found in the variety of plasma
modes often provide better process results than wet chemistry or
ordinary mechanical means. Hence, in some manufacturing
environments plasma provides the only solution.
BSET EQ was founded in 1996. We have been manufacturing plasma systems and designing plasma processes since 1998. Since our beginning we have developed a strong product line and together with our customers have made great contributions to the industries.
High tech, flexibility and affordable solutions have always been important assets at BSET EQ. Whether you are doing R&D or full scale production runs it is likely that we have a system designed for your application.
Drawing from our experience of more than twenty years we have also earned considerable notoriety for our special system designs and processes.
BSET EQ offers laboratory services to help qualify its plasma technologies and equipment for your applications. We are proud to extend these valuable services before, and after ownership of our quality equipment.
In addition to manufacturing our own products we are committed to providing any number of services related to the technology or our customers needs.
Three Plasma System Models
BSET PLASMAS currently has three plasma system models used for etching solar cells, or cleaning and removing oxides and organic contaminants, such as resin, carbon, epoxies, and polyamides for electronic related packaging. The plasma etch process can be used for photoresist removal, polymer etching, and removal of epoxy contamination. Plasma systems have also been highly useful for surface preparation in the fields of medical devices and printed circuit board manufacturing, as well as mims and fiber optic assembly.
SP Series
Small to medium-sized table top barrel systems (4, 6 and 10" barrel applications). These plasma systems can be used for cleaning, ashing, or etching applications.
NT Series
Consists of three products:
• NT - 1
• NT - 2
• NT - 3
These systems utilize a unique system for configuing the electrodes and are hence very flexible in their application.
FA 2000 Series
This series is comprised of three configurations. The FA 2000 decap is configured for plasma decapsulation of packaged devices and/or backside wafer thinning. The FA-2000-6 and FA-2000-8 are configured for IC delayering of packaged devices or 6" or 8" wafer formats. All plasma units are intended for use in failure analysis or R&D efforts in the semiconductor fab or assembly house.
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