Film Stress Bow Measurement Frontier Semiconductor FSM
FSM  413 Series

FSM 413 Series

Request for Quotation



Substrate Thickness, Warp, and TTV Measurement
- with or without Tape
- for Wafer Backgrind and Etch Thinning processes.
Non-contact Echoprobe Technology.
Thin film and surface roughness options.
413 SA -- Semi-automatic system with enclosure. Manual loading, automatic measurement up to 300mm.
413 EC -- Manual loading, manual positioning system.
413EC-MOT -- Auto-Mapping, manual loading system.
413C2C -- Cassette to Cassette System for Wafer or Dicing tape frames

Request for Quotation(*Compulsary Fields)

Your Name:*


Email Address:*

Contact Number:*


Product of Interest:*