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Film Stress Bow Measurement Frontier Semiconductor FSM
FSM  413 Series

FSM 413 Series

Substrate Thickness, Warp, and TTV Measurement
- with or without Tape
- for Wafer Backgrind and Etch Thinning processes.
Non-contact Echoprobe Technology.
Thin film and surface roughness options.
413 SA -- Semi-automatic system with enclosure. Manual loading, automatic measurement up to 300mm.
413 EC -- Manual loading, manual positioning system.
413EC-MOT -- Auto-Mapping, manual loading system.
413C2C -- Cassette to Cassette System for Wafer or Dicing tape frames

Product Description

Substrate Thickness, Warp, and TTV Measurement
- with or without Tape
- for Wafer Backgrind and Etch Thinning processes.
Non-contact Echoprobe Technology.
Thin film and surface roughness options.
413 SA -- Semi-automatic system with enclosure. Manual loading, automatic measurement up to 300mm.
413 EC -- Manual loading, manual positioning system.
413EC-MOT -- Auto-Mapping, manual loading system.
413C2C -- Cassette to Cassette System for Wafer or Dicing tape frames

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