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FSM 128 Series
Bow and Global Film Stress Measurement.
Non-contact full wafer stress mapping for semiconductor and flat panel application.
Dual Laser Switching Technology.
128NT -- Base system. Up to 200mm wafer. Rotation Stage.
128L -- Up to 300mm wafer. Rotation Stage.
128G - 450 -- NEW. Up to 450mm wafer. Flat panels. Rotation Stage.
128L C2C -- Cassette to cassette
FSM 413 Series
Substrate Thickness, Warp, and TTV Measurement
- with or without Tape
- for Wafer Backgrind and Etch Thinning processes.
Non-contact Echoprobe Technology.
Thin film and surface roughness options.
413 SA -- Semi-automatic system with enclosure. Manual loading, automatic measurement up to 300mm.
413 EC -- Manual loading, manual positioning system.
413EC-MOT -- Auto-Mapping, manual loading system.
413C2C -- Cassette to Cassette System for Wafer or Dicing tape frames
FSM 500 Series
FSM 900 Series
Stress Hysteresis in vacuum or gas up to 900C for the study of annealing cycles.
Thermal Desorption, Film Shrinkage, Reflectivity, and Resistivity options provide additional insight to causes of material changes with temperature.
900TC-VAC -- 300mm chamber. Manual loading.
900C2C -- 300mm fully automated Cassette to Cassette system.